TongFu Microelectronics is a leading enterprise of integrated circuit packaging and testing in China, providing one-stop design simulation and packaging and testing services for global customers
The implementation is based on extensive experience consulting/structuring with the relevant industries, and results in successful completion of the entire CIM build necessary for production planning/order to ship, production experience of all process steps, and tracking/analysis of EDC data, materials, tools etc within the required time frame.
The system can collect and record the real-time data in the production process, make the report data more comprehensive and more accurate, and provide the basis for enterprise decision-making.
According to the set monitoring indicators and rules, the system can monitor the abnormal conditions in the production process in real time, and timely issue early warning to improve the efficiency of fault handling.
Phone
TOP